Solamet® PV Aluminum Pastes

Solamet® PV Aluminum Metallization Pastes for Local Back Surface Field Solar Cell Designs

To help lower LCOE DuPont is actively engaged in the development of Solamet® metallization pastes for new cell architectures that can deliver >22% cell efficiency.

DuPont™ Solamet® PV36x series photovoltaic metallization pastes enable lower laydown of less than 1 g per 6” x 6” wafer and up to 0.8 percent greater efficiency with LBSF cell designs.  They are high performance conductive aluminum compositions, developed as a back surface conductor compatible with the i-PERC process for Local Back Surface Field (Local BSF) designs of silicon solar cells.

DuPont offers two new products as part of the series:

• DuPont™ Solamet® PV361 is designed for laser fired local contact formation.
• DuPont™ Solamet® PV362 is optimized for i-PERC process for Local BSF designs

Additional product benefits include:

• Very good local BSF formation with minimum voiding
• High adhesion on passivation layer (SiO2/SiNx, Al2O3/SiNx stacks) with no dielectric damage
• Fast drying and firing
• Low electrical resistivity after firing

Both products are compatible with the latest Solamet® tabbing silver pastes and the new DuPont™ Solamet® PV701 photovoltaic metallization for Metal Wrap Through designs.